The subcontracted semiconductor assembly and testing (manufacturing) provides third party integrated circuit conditioning and testing facilities. OSATs are merchant sellers. IDMs and foundries often outsource a certain percentage of their IC packaging production to OSATs with in-house packaging operations.
New York, August 25, 2021 (GLOBE NEWSWIRE) – Reportlinker.com Announces the Publication of the “Outsourced Semiconductor Assembly and Testing Market by Service Type, Packaging Type and Application: Analysis of Global Opportunities and industry forecast, 2021-2028 “- https://www.reportlinker.com/p06126662/?utm_source=GNW
Fabulous companies often outsource their packaging to foundries and / or OSATs. Semiconductors are also used by many modern consumer goods in everyday life, such as cell phones, laptops, video cameras, televisions, washing machines, refrigerators, and LED bulbs. In addition, a preference for large screens and curved OLEDs due to the growing popularity of smart TVs, 4K ultra-HD TVs, 3D programming and video on demand content is driving OSAT revenue. OSATs provide cost effective and creative solutions that deliver higher efficiency, processing speeds and functionality with reduced space in an electronic device.
Factors such as increasing demand for consumer electronics and increasing degree of urbanization across the world are primarily fueling the growth of the market. In addition, the growing disposable income of people across the world has significantly boosted the sales of consumer electronics devices such as televisions, cellphones and tablets, increasing the demand for assembly and semi-testing services. outsourced drivers. Moreover, the increase in the adoption of smartphones is significantly propelling the growth of the market. However, the high costs associated with OSAT services may hamper the growth of the market during the forecast period. On the contrary, the growth of the chip market is expected to provide a huge opportunity for OSAT companies. In addition, the growing transition to emerging OSAT economies such as India, China, and South Korea is opportunistic for market growth.
The global outsourced semiconductor assembly and testing market share is analyzed by service type, packaging type, application, and region. On the basis of the type of service, the market is analyzed through testing and assembly. On the basis of package type, the market is divided into ball die, chip package, multi-package, stacked die and quad and double. Depending on the application, the market is categorized into automotive, consumer electronics, industrial, telecommunications, and others. Based on region, it is analyzed across North America, Europe, Asia-Pacific and LAMEA as well as their major countries.
The major market leaders of integrated processors presented in the report include XXX. These key players have adopted strategies, such as product portfolio expansion, mergers and acquisitions, agreements, geographic expansion and collaborations, to improve their market penetration.
By type of service
By type of packaging
• Ball grid table
• Chip scale package
• Multiple package
• Stacked matrix
• Quad & Double
• Consumer electronics
• North America
o United States
o Rest of Europe
• Asia Pacific
o Rest of Asia-Pacific
• ASE Technology Holding, Co., LTD.
• Amkor Technology, Inc.
• Jiangsu Changjiang Electronics Technology Co., LTD
• Powertech Technology Inc.
• Tianshui Huatian Technology Co., LTD.
• TongFu Microelectronics Co., LTD.
• King Yuan Electronics Corp.
• Hana Micron Inc.
• ChipMOS Technology Inc.
• Unisem Group
Read the full report: https://www.reportlinker.com/p06126662/?utm_source=GNW
ReportLinker is an award winning market research solution. Reportlinker finds and organizes the latest industry data so you get all the market research you need – instantly, in one place.
CONTACT: Clare: [email protected] US: (339)-368-6001 Intl: +1 339-368-6001